OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

For true 3D die-to-die integration, STA is required for standard timing signoff just as it is for other designs. “Two die connected through stacking is equivalent to two floorplan blocks connected ...

3D integration enables heterogeneous integration of IC chips fabricated with different technologies and materials, and thus permits the realization of integrated, sophisticated, and multifunctional ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

Custom Materials, Inc., a leading innovator in advanced material solutions, is shaping the future of 3D Integrated Circuits (3D IC). The leading custom fabrications company is elevating its ...