OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...

In this 3D integration scenario, an important differentiator is that interposers and 3D chip stacks are still attached to BGA and LGA packages, which then are mounted to the PCB. These interposers are ...

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...

3D integration enables heterogeneous integration of IC chips fabricated with different technologies and materials, and thus permits the realization of integrated, sophisticated, and multifunctional ...

Custom Materials, Inc., a leading innovator in advanced material solutions, is shaping the future of 3D Integrated Circuits (3D IC). The leading custom fabrications company is elevating its ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...