However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

We’re used to impressive soldering work here at Hackaday, and we’ve seen our share of wiring direct to the balls on an upturned BGA chip. This is a similar idea but at another level ...

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components ... superb voiding control, minimizing void formation and avoiding short defects caused by ball volume expansion ...