However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components ... superb voiding control, minimizing void formation and avoiding short defects caused by ball volume expansion ...