This image shows those connections which use magnet wire on a DIP breakout board. [Jason] used epoxy to glue the wafer down before grabbing his iron. It took 90 minutes to solder the nine ...

However, for many people, ball grid array (BGA) is still intimidating ... We’ve seen the very patient hand solder wires to BGAs. You can also find more detailed videos and compare other ...

SHENMAO America, Inc. is proud to announce that its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure) certification for recycled content. This prestigious ...

Tucson, AZ USA Abstract : Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the ...