Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Nordic Semiconductor, a global specialist in low power wireless connectivity solutions, has made a further addition to its nPM family of Power Management ICs ...

The power electronics market is influenced by increasing demand for energy efficiency and renewable energy sources. However, ...

Infineon Technologies AG has introduced new isolated gate driver ICs for EVs to enhance its EiceDRIVER family. The devices are designed for the latest IGBT and SiC technologies. Also, they support the ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

The GaN Semiconductor Devices market is witnessing rapid expansion due to the growing need for energy-efficient and high-performance technologies. Akash Anand SNS Insider +1 415-230-0044 ...