The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

Reactive Ion Etch (RIE) is a physical etch process. A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch.

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The PlasmaPro 100 Cobra ICP RIE system ...

The negatively charged and extremely reactive fluorine ions are attracted to the wafer, where they attack and etch away the surfaces that aren’t protected by a photoresist layer. It all sounds ...