OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

Custom Materials, Inc., a leading innovator in advanced material solutions, is shaping the future of 3D Integrated Circuits (3D IC). The leading custom fabrications company is elevating its ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

We recently compiled a list of the Blackrock’s 30 Most Important AI Stocks. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) stands ...

We are seeing several issues affecting the semiconductor industry as we enter the new year with geopolitical volatility and ...

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...

Circuits Integrated Hellas (CIH), a pioneering innovator in advanced satellite communication (SatCom) technology, has been selected as a laureate startup to compete in the Innovation Challenge at ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

The collaboration between MediaTek and embedded software firm Exein aims to make security an integral part of the development Continue Reading ...

Abstract: Monolithic designs face significant fabrication cost and data movement challenges, especially when executing complex and diverse AI models. Advanced 2.5D/3D packaging promises high bandwidth ...