Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...
Think of this as your winter packing checklist. Lydia Mansel is a writer with more than eight years of experience editing and writing for both brands and online publications—with a particular ...
The dawn of 2025 marks a turning point for the packaging industry in the UK, with the introduction of the Extended Producer Responsibility (EPR) regulations. / Credit: cybrain via GettyImages As we ...