Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

The power electronics market is influenced by increasing demand for energy efficiency and renewable energy sources. However, ...

The Power Electronics Market is driven by the surging adoption of electric vehicles, renewable energy systems, and advanced energy-efficient technologies.Austin, Feb. 03, 2025 (GLOBE NEWSWIRE) -- ...

OKI achieves three-dimensional (3D) integration of thin-film analogue ICs using Crystal Film Bonding (CFB) technology.

The GaN Semiconductor Devices market is witnessing rapid expansion due to the growing need for energy-efficient and high-performance technologies. Akash Anand SNS Insider +1 415-230-0044 ...

Nordic Semiconductor, a global specialist in low power wireless connectivity solutions, has made a further addition to its nPM family of Power Management ICs ...

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of ...