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日本三井住友银行推出半导体设备抵押贷款,铠侠已率先获益
IT之家 1 月 17 日消息,据 Nikkei Asia 今日报道,日本银行业巨头三井住友银行面向半导体企业推出了制造设备抵押贷款,而铠侠已在去年率先获益。 半导体行业存在明显的荣枯循环,这影响了芯片制造商的稳定偿债能力 ...
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